Potting & Encapsulating Resins

PAR are the sole distributor & stockist in the UK & Ireland for Von Roll Group resins & varnishes.  This includes the renowned John C Dolph Company (Dolph’s) & Albesiano Sisa Vernici brands of products.  The range includes potting and encapsulating resins, adhesives and balancing compounds.  

ProductColourMixed Viscosity @ 25°C cPs

Hardness Shore

Thermal Conductivity W/mKUL 94Properties
CASTING, POTTING & ENCAPSULATING RESINS 
POLYURETHANE RESINS
Polyurethane resins are flexible, elastomeric compounds, available from low viscosity to thixotropic pastes. Features include good resistance to moisture & chemicals, excellent impact & abrasion resistance, thermal shock ranging from -40 to + 155°C, excellent electrical and sealing properties, with good noise and vibration dampening properties.
PAR INSULDERM® PU-700Black2,000 – 3,00060D 0.39N/AGeneral purpose filled potting & casting, flame retardant, low viscosity
PAR PC 6124J  Various2,240 – 4,22085-95A0.476V-0General purpose filled potting & casting, low viscosity
DAMIVAL® U512 (13518) Various2,00087D0.65V-0EN45545-2 railway approval, high glass transition temperature, various gel-times 
DAMIVAL® 13524Various1,50050D0.33N/ASemi-rigid, hydrophobic, good thermal resistance, low viscosity
DAMIVAL® 13551Various2,30070A0.80N/AGood adhesion properties
DAMIVAL® 13552 Various3,00050D0.78V-0Semi-rigid, compliant with EN 45545-2 railway standard. Good thermal conductivity & chemical resistance
DAMIVAL® U513 (13553) Various3,00090A0.81V-0Compliant with EN 45545-2 railway standard. Good thermal conductivity & chemical resistance. Excellent adhesion, 150°C thermal rating
DAMIVAL® 13654  Various1,40085A0.80V-0Good thermal conductivity, low viscosity, semi-flexible
DAMIVAL® 13203 AN65 Black20,000 mPas75A1.76V-0Very high thermal conductivity
DAMIVAL® U510 (Dolphon® 1138)Various3,50040D 0.75V-0General purpose filled potting & casting
POLYBUTADIENE RESINS
Polybutadiene resins are flexible, elastomeric compounds. Especially formulated for encapsulating electrical & electronic devices, they have excellent hydrolytic stability, good thermal conductivity, low thermal shock ranging from -70 to + 155°C. Other features are extraordinary resistance to moisture and chemicals, excellent adhesion, easy to repair, excellent replacement for silicone and epoxy resins.
DAMIVAL® 13653Various3,00075A0.24N/AVery hydrophobic, long-term sea water resistance, high adhesion
DAMIVAL® U601 (13681)Various3,30051A0.28N/A MDI free, high thermal resistance up to 150°C
DAMIVAL® U602 (13682) Various5,00046A0.95V-0 MDI free, high thermal conductivity, high thermal resistance up to 150°C.  Compliant with EN 45545-2 railway standard 
DAMIVAL® 13683 Various5,60061A1.30V-0 MDI free, high thermal conductivity, high thermal resistance up to 150°C.  
DAMIVAL® U600(80) (Dolphon® CB-1109-80)
Black
3,000 45A 0.35N/AVery flexible with excellent moisture resistance, even in severe conditions
Clear
2,00025A 0.20N/A
Unfilled, low viscosity, very soft, repairable, 
particularly suitable for electromagnets & low stress applications
Cream
5,000 – 12,00050A V-0
General purpose potting & casting
EPOXY RESINS
Epoxy resins vary from flexible to rigid compounds and range from low viscosity to paste-like thixotropic adhesives. Features include good resistance to moisture & chemicals, excellent impact & abrasion resistance, thermal shock ranging from -40 to + 180°C, excellent electrical and sealing properties. A series of reactors is available for most products to tailor each system to specific requirements.
DOLPHON® CC-1024Clear2,50075D0.20N/ALow viscosity, semi-flexible. Suitable for impregnation
DOLPHON® CR-1035Red5,00085D0.25N/AFilled low viscosity for impregnation & encapsulation
DOLPHON® C(a)-1037Various4,000 @ 60°C85D0.70N/AHot cure, high glass transition temperature, excellent thermal shock resistance
DOLPHON® CB-1078Black6,00085D0.50N/AFilled resin with good thermal conductivity & low shrinkage
DOLPHON® CC-1079Clear7,50085D N/AUnfilled medium viscosity resin for vacuum casting of transformers
DOLPHON® CN-1107Cream3,00045D0.90V-0MDI-free, semi-flexible, high resistance to thermal shocks & cycling
Damival® E110 (Dolphon® 1114) Various6,00085D 0.80V-0
Filled halogen-free resin. Compliant with EN 45545-2 railway standard

DAMIVAL® E112 (Dolphon® 1123)

Various3,00085D1.37V-0High thermal conductivity, filled, halogen-free resin
BATTERY SOLUTIONS FOR EV & HYBRID ELECTRIC SYSTEMS
DAMIVAL® U602 (13682)Various5,00046A0.95V-0MDI free, high thermal conductivity, high thermal resistance up to 150°C.  Compliant with EN 45545-2 railway standard 

DAMIVAL® 13683 

Various 5,60061A1.30V-0 MDI free, high thermal conductivity, high thermal resistance up to 150°C.  
DAMIVAL® U620 Grey110,00082A2.40V-0Thermal adhesive suitable for cell bonding/fixing. very high thermal conductivity, non-sagging, not CMR classified
Product ReferenceColourReactor Product ReferenceResin TypeProduct TypeSet Time @ 25°C Properties
ADHESIVES
PAR MPS HOT MELT ADHESIVE SYSTEMNatural1 PartThermoplasticHot melt20-30 secsGeneral purpose hot melt adhesive, for the bonding of fabrics, tapes, plastic, metal, wood & card. May be applied by hand or through a gun.
3M® SCOTCH-WELD® 9323-2 B/ABlackXA-9321Epoxy2 Part resin150 minExcellent bond strength, high impact resistance, good environmental, resistance, bonds metal to metal.
3M® SCOTCH-GRIP® 847Brown1 PartNitrile rubber1 Part resin15 minQuick drying, resistant to many oils & fuels, bonds leather, nitrile rubber, plastics & most gasket materials to a wide variety of substrates.
DOLPHON® X-206/AClearX-206/BEpoxy2 Part resin60 minGood bond strength to a variety of substrates, elastic, excellent resistance, to mechanical shock, moisture, oil, solvent, acid & alkali resistant.
DOLPHON® CR-1056/BRedCR-1056/AEpoxy2 Part paste2 hrsExcellent adhesion & bond strength to a wide variety of substrates, flexible, good mechanical & thermal shock resistance, easy to machine.

PAR are the sole official UK distributor and stockist for Star Technology armature balancing compounds.

Product ReferenceColour Part AColour Part BColour MixedPot Life @ 25°C Full Cure

Thermal Class 

°C 

ARMATURE BALANCING COMPOUNDS
ROOM TEMPERATURE CURE

 A range of epoxy compounds for use in the weight addition balancing of electric motor armatures, rotors and fans, as well as sealing and gap filling in general engineering/electronic applications. A smooth putty consistency ensures the compound does not migrate during the balancing process. 

BC-22BlueYellowGreen2 hrs24 hrs @ 25°C-40 to +205
BC-28BlueYellowGreen1 hr24 hrs @ 25°C-40 to+205
BC-178BlueYellowGreen1 hr24 hrs @ 25°C-40 to +205
BC-29BlueYellowGreen3 hrs24 hrs @ 25°C-40 to +205
DOLPHON® CV-1108YellowBlueGreen4 hrs24 hrs @ 25°C-40 to +180
HEAT CURE

A range of single part compounds designed to support manual or automatic applications in the weight addition balancing of electric motor armatures, rotors and fans. As the product does not require mixing, both waste and production time are reduced.

BC-10White1 Part/1 year20 mins @ 150°C-40 to +260
BC-15Red1 Part/1 year20 mins @ 175°C-40 to +260
UV CURE

 A range of single part compounds designed to support manual or automatic applications in the weight addition balancing of electric motor armatures, rotors and fans. Production time can be vastly increased, as the compound cures in 5 to 30 seconds under a UV lamp. 

BC-30Purple1 Part/1 year100 -120 j/cm2-40 to +175
BC-40Grey1 Part/1 year100 -120 j/cm2-40 to +175
BC-50 White1 Part/1 year100 -120 j/cm2-40 to +175