Brazing & Soldering Alloys & Fluxes
Product Reference | Copper % | Phosphorus % | Other % | Melting Range °C | Specification EN 1044:1999 | Specification ISO 17672:2010 | Supply Formats |
|---|---|---|---|---|---|---|---|
BRAZING ALLOYS – COPPER/PHOSPHORUS | |||||||
Brazing with Silver-Copper-Phosphorus and Copper-Phosphorus alloys is widely used for joining of Copper to Copper where the absence of a flux is a major benefit. The self-fluxing action of the Phosphorus ensures that flux entrapment problems are largely avoided and that high standards of joint soundness can be maintained. High Phosphorus levels give excellent capillary penetration since the fluidity of the molten brazing alloy is controlled by the Phosphorus content Alloys with high Phosphorus content are less ductile than those with lower Phosphorus and higher Silver contents. For applications where optimum mechanical strength, or resistance to vibration, is required the lower Phosphorus alloys are necessary (i.e. Phos 5, Phos 2 and Phos 0). The tin-containing alloy, Phos OT, offers controlled fluidity, a low melting point and joints of good appearance. Phosphorus containing alloys should not be used on Ferrous or Nickel based parent alloys as they will result in brittle joints. This family of alloys can also be used for brazing high copper content alloys, providing that a suitable flux is used. | |||||||
| 92.5 | 7.5 | 0 | 714 – 810 | CP201 | CuP 182 | Rod, wire, rings | |
PHOS OA | 92 | 6 | Sb 2 | 690 – 825 | CP301C | CuP 389 | Rod, wire, rings |
PHOS OR | 93.8 | 6.2 | 0 | 714 – 890 | CP203 | CuP 179 | Rod, wire, rings |
PHOS OT | 92.5 | 7.5 | Sn 7 | 640 – 680 | CP302 | CuP 386 | Rod, wire, rings |
Product Reference | Copper % | Phosphorus % | Silver % | Melting Range °C | Specification EN 1044:1999 | Specification ISO 17672:2010 | Supply Formats |
|---|---|---|---|---|---|---|---|
BRAZING ALLOYS – SILVER/COPPER/PHOSPHORUS | |||||||
PHOS 2 | 91.7 | 6.3 | 2 | 644 – 825 | CP105 | CuP 279 | Rod, wire, rings |
| 89 | 6 | 5 | 644 – 815 | CP104 | CuP 281 | Rod, wire, rings | |
PHOS 6 | 87 | 7 | 6 | 644 – 718 | / | CuP 283 | Rod, wire, rings |
| PHOS 6N | 86.7 | 7.3 | 6 | 645 – 725 | CP103 | / | Rod, wire |
| 80 | 5 | 15 | 644 – 80 | CP102 | CuP 284 | Rod, wire, rings, foils, strips | |
PHOS 18 | 75 | 7 | 18 | 644 | CP101 | CuP 286 | Rod |
Product Reference | Description | Working Range °C | Specification EN 1045:1997 | Supply Formats |
|---|---|---|---|---|
BRAZING FLUXES | ||||
The correct choice of flux is the key to good brazing practice and many problems arise from the incorrect selection or ineffective application of flux. A good match between the flux and the brazing alloy/parent metal combination is essential if strong, sound joints are to be produced. The flux layer performs the critical function of cleaning and protecting the surface of the parent metal during brazing, and so facilitates the ‘wetting’ and flow of the brazing alloy. Not only is it important that the proper flux is selected, but also that sufficient flux is applied to the joint area to provide protection throughout the brazing cycle. A further benefit is, that if excess flux is applied in the immediate joint area, oxidation of adjacent surfaces may be prevented, so reducing post-brazing cleaning costs. As a guide, the flux selected should be active at least 50°C below the solidus and 50°C above the liquidus of the brazing alloy selected. | ||||
| Y FLUX POWDER & PASTE | This product is a medium life flux with good activity and fluidity. It is suitable for the lower melting point silver brazing alloys which require moderate time cycles on heating. Y Flux Powder is suitable for use on copper, brasses, mild and stainless steel parent metals as well as copper alloys and tungsten carbides. | 650 – 750 | FH10 | 0.5/1Kg Pots |
| U FLUX POWDER & PASTE | This product is a medium to long life flux with good activity and fluidity. It is suitable for the lower melting point silver brazing alloys which require moderate time cycles on heating. | 600 – 800 | FH10 | 0.5/1Kg Pots |
| F FLUX POWDER & PASTE | This product is a long life flux with moderate activity and fluidity. It is suitable for the low and medium melting point silver brazing alloys which require moderate to long time cycles on heating. | 650 – 850 | FH10 | 0.5/1Kg Pots |
| Castolin Eutectic & Johnson Matthey brand products are also available from PAR. Please contact us with your specific requirements. | ||||
Specification BS EN 29453, Alloy No. | Specification BS 219 | Composition | Melting Range °C | Applications |
|---|---|---|---|---|
| SOLDER ALLOY SELECTION GUIDE | ||||
A wide range of high purity soldering alloys in a variety of formats, including traditional tin and lead based alloys, and RoHS compliant lead-free alloys. As well as the BS EN 29453 and BS 219 specifications listed below, we can also offer alloys from ISO 9453 and IPC-J-STD-006A specifications on request. | ||||
| 1a | Exceeds AP | Sn/Pb | 183 | SM Electronics |
| 2a | Exceeds KP | Sn/Pb | 183-190 | SM Electronics |
| 3a | / | Sn/Pb | 183-215 | Electronics |
| 1 | AP | Sn/Pb | 183 | Electronics |
| 2 | KP | Sn/Pb | 183-190 | Electronics |
| 3 | / | Sn/Pb | 183-215 | Tinning |
| 4 | R | Sn/Pb | 183-226 | Electrical/Industrial |
| 5 | G | Sn/Pb | 183-235 | Tinning |
| 6 | H | Sn/Pb | 183-245 | Plumbing/Jointing |
| 7 | J | Sn/Pb | 183-255 | Plumbing/Automotive |
| 8 | / | Sn/Pb | 268-302 | High temperature |
| 9 | / | Sn/Pb | 280-305 | High temperature |
| 10 | / | Sn/Pb | 320-325 | High temperature |
| 11 | A | Sn/Pb/Sb | 183 | Electrical |
| 12 | K | Sn/Pb/Sb | 183-190 | Electrical/Tinning |
| 13 | F | Sn/Pb/Sb | 183-216 | Tinning |
| 14 | C | Sn/Pb/Sb | 185-231 | Tinning |
| 15 | D & L | Sn/Pb/Sb | 185-250 | Plumbing/Jointing |
| 16 | / | Sn/Pb/Sb | 185-263 | Industrial |
| 17 | N | Sn/Pb/Sb | 185-270 | Automotive |
| 18 | 95A | Sn/Sb | 230-240 | Electrical/Industrial, high temperature, Pb free |
| 19 | / | Sn/Pb/Bi | 180-185 | Special applications |
| 20 | / | Sn/Pb/Bi | 178-205 | Special applications |
| 21 | / | Sn/Bi | 138 | Pb/Cd Free low temperature |
| 22 | T | Sn/Pb/Cd | 145 | Low temperature |
| 23 | 99C | Sn/Cu | 230-240 | Pb Free Plumbing |
| 24 | / | Sn/Cu | 230-250 | Pb free |
| 25 | / | Sn/Pb/Cu | 183-190 | Special electronic/Electrical |
| 26 | / | Sn/Pb/Cu | 183-215 | Electrical/Industrial |
| 27 | / | Sn/In | 117-125 | Glass to metal |
| 28 | 96S | Sn/Ag | 221 | High temperature/Pb free electronics |
| 29 | 97S | Sn/Ag | 221-230 | Pb free |
| 30 | 62S | Sn/Pb/Ag | 178-190 | Special SM electronics |
| 31 | / | Sn/Pb/Ag | 178-180 | Special SM electronics |
| 32 | / | Pb/Ag | 304-305 | Special high temperature |
| 33 | / | Pb/Ag | 304-365 | Special high temperature |
| 34 | 5S | Sn/Pb/Ag | 296-301 | High temperature electrical |
| Elements Legend | ||||
| Ag = Silver, Bi = Bismuth, Cd = Cadmium, Cu = Copper, In = Indium, Pb = Lead, Sb = Antimony, Sn = Tin | ||||
| HIGH PURITY SOLDER ALLOYS |
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| HIGH PURITY™ SOLDER BARS & WIRES |
| PAR High Purity™ solder is available in Bar (0.5/1Kg), Tinmans sticks (250g), Blowpipe sticks (50-80g), Pellets, Chunks, Chips (1Kg & 5Kg bags) and Ingots (5Kg bars). PAR Solid Solder Wires contain no flux and are available on a variety of stndard and DIN specification reels from 250g – 25Kgs. PAR High Purity™ solders are intended for general industrial tinning applications . |
| CORED SOLDER WIRE |
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| PAR cored solder wires are available on a variety of standard and DIN specification reels from 100g – 25Kgs. PAR cored solder wires are intended for a range of soldering applications. |
| HIGH-SPEED CORED SOLDER WIRE |
A range of rosin (colophony) based, halide activated cored solder wires in a no clean ROL1 and ROM1 formulations. PAR solders offer the greatest performance required for high speed soldering applications, whether it be automated or manual. High speed cored solder wire exhibits the absolute minimum of clear, no clean soldering residue and can be cleaned with solvent or saponifier cleaning processes, leaving bright solder joints with no white residue. |
| COLOPHONY-FREE CORED SOLDER WIRE |
| A range of colophony free rosin cored solder wires, which contain no rosin/resin acids, pine oil, or other naturally occurring derivatives from pine tress. Colophony free cored solder wires are specifically designed to reduce occurrences of operator asthma, which can occur as a result of using traditional colophony based rosin cored solder wires. |
| NO CLEAN CORED SOLDER WIRE |
| A range of rosin (colophony) based, halide free, fast flowing, no clean cored solder wires. No clean cored solder wires offer the greatest post soldering residue reliability and has become the standard for the telecommunications industry. |
| NO CLEAN CORED SOLDER WIRE – CLEAR RESIDUE |
| This product offers the same benefits as standard no clean cored solder wire, but with the added benefit of a clear post soldering residue. |
| WATER WASH CORED SOLDER WIRE |
| A range of colophony free, water washable cored solder wires. Water wash cored solder wires exhibit minimum fuming during use, and the absolute minimum ionic contamination after cleaning. |
| ACID CORED SOLDER WIRE |
| Mainly used for metal fabrication, acid cored solder wire is particularly suited for use on stainless steel and other hard to solder metals. |
| SOLDER PAINT |
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| Solder paint is a liquid, uniformed mixture of finely powdered solder and zinc chloride activated flux, providing a creamy consistency. Solder paint finds use in general sweating and tinning applications. As with other zinc chloride based fluxes, the residue can be corrosive, so it is advisable that such residues be removed. Available in alloys Sn25/Pb75, Sn40/Pb60, Sn60/Pb40, Sn97/Cu3 and Pure Tine. |
| SOLDERING FLUXES & THINNERS |
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| PAR have a wide range of soldering fluxes & thinners available to suit various processes, including wave soldering. A range of our general soldering fluxes are listed below, but please contact our sales department with your specific requirements. |
| ALCHO-RE PASTE |
| Resin flux based paste, for general soldering of copper or tinned surfaces where a non-corrosive residue is required. |
| ALCHO-RE FLUID |
| Resin flux based fluid, for general soldering of copper or tinned surfaces where a non-corrosive residue is required. |
| FRY BAKERS FLUID NO.3 |
| Zinc chloride water based fluid, for general soldering of copper, brass and tinned surfaces. Corrosive residues must be removed with water and hydrochloric or citric acid. |
| FRY RADSOL T208B & T208C |
| T208B (Water based) & T208C (Alcohol based) fluxes, for soldering of copper, copper alloys, tinned and certain plated surfaces where a non-corrosive residue is required. (Zinc chloride free). |